Wafer packaging
The application solutions of Unicom Technology equipment in wafer-level packaging
Preface: Precise Measurement, Empowering the Evolution of Advanced Packaging Technology
As semiconductor technology moves towards smaller nodes and higher integration, wafer-level packaging, as a key technology for enhancing chip performance and reducing packaging size, is becoming increasingly important. Wafer-level packaging processes involve multiple complex steps such as thin film deposition, photolithography, etching, and electroplating. Among them, the precise measurement and control of thin film thickness, 3D morphology, surface roughness, and various microstructure dimensions directly determine the performance, reliability, and yield of the final product. Unicon Technology Co., LTD., relying on the world's top metrology and testing equipment it represents, provides comprehensive and high-precision solutions from R&D to mass production for wafer-level packaging processes.
The key applications of our core equipment in wafer-level packaging are as follows:
| Equipment category | Core applications and values in wafer-level packaging |
Accurately measure the thickness and uniformity of the rewiring layer, polymer isolation layer, photoresist and various dielectric layers to ensure that the film quality meets the design requirements. | |
Non-contact 3D topography measurement is carried out on through-silicon vias, bumps/solder balls, scribble grooves, etc., providing key data such as depth, height, coplanarity and roughness. | |
Perform rapid and high-precision 2D/3D contour scanning to measure the step height of the film pattern and evaluate the surface roughness and waviness. | |
Evaluate the nanomechanical properties of packaging materials (such as underfills and molding compounds), measure their hardness and elastic modulus, and provide a basis for material reliability. |
Summary
From thin-film property control to three-dimensional structure analysis and material mechanical property evaluation, Unicom's equipment portfolio covers multiple key quality control nodes in wafer-level packaging. We are committed to providing customers with precise, stable and efficient measurement solutions to help improve the yield and product reliability of advanced packaging processes.
If you are looking for precision measurement equipment in the field of wafer-level packaging or wish to obtain detailed technical data and application cases of the above solutions, please feel free to contact Unicon Technology at any time. Our professional team will provide you with personalized product selection and technical consultation services.
