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    • FILMETRICS Film thickness Gauge - Application in Optoelectronic Integrated Chip Technology

      Optoelectronic integrated chip technology encompasses the epitaxial growth of optoelectronic chips, the design and fabrication of optoelectronic chips, the process development and packaging of optoelectronic chips, etc. Especially in the process of manufacturing optoelectronic integrated chips, it is necessary to strictly control the thickness of film layers such as SiOx and SiNx in order to achieve the desired process effect. The Filmetric SF20 white light interference film thickness measuring instrument, as a high-performance device with high precision, fast testing speed and easy operation, can conveniently and quickly measure the thickness of these film layers.

      2025-09-02 admin
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    • Unicon invites you to meet at the 2021 China International Optoelectronic Expo

      The 23rd China International Optoelectronic Exhibition (abbreviated as CIOE) will be held at the Shenzhen International Convention and Exhibition Center. The concurrent six exhibitions will cover sections such as information and communication, lasers, infrared, ultraviolet, precision optics, lenses and modules, and sensors, showcasing cutting-edge optoelectronic innovation technologies and comprehensive solutions for the optoelectronic and application fields. Master the latest industry trends, understand market development trends, and assist enterprises in conducting business negotiations with upstream and downstream players in the optoelectronic industry. ● Time: September 16th - 18th, 2021 ● Location: Bao 'an New Venue, Shenzhen International Convention and Exhibition Center ● Our Location: Unicon Exhibited products < &

      2025-09-02 admin
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    • All engineers of Unicon participated in the training of the Horiba scientific instrument series products

      With the increasing number of Uniconon's customer base, in order to further meet the needs of the majority of customers, Uniconon has recently introduced various products of the Horiba scientific instrument series.

      2025-09-02 admin
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    • The 2022 Suzhou Taicang Advanced Technology and Application Conference on Compound Semiconductors concluded successfully

      The 2022 Suzhou Taicang Advanced Technology and Application Conference on Compound Semiconductors concluded successfully

      2025-09-02 admin
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    • Introduction to Active Vibration Damping System

      The active vibration damping system is a system specially designed to reduce the vibration of equipment with heavy loads and large bases. This system consists of several unit modules and an external control unit. Each module can bear a maximum load of 2 tons (the system's load capacity reaches 8 tons). In addition, the vibration damping module can also eliminate the vibration it generates itself and prevent it from affecting the vibration damping object.

      2025-09-02 優(yōu)尼康
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    • Event Invitation - Advanced Thin Film Materials Analysis and Testing Seminar (Online and Offline Simultaneously)

      Unicon Technology Co., Ltd. invites you to participate in the "Advanced Film Materials Analysis and Testing Seminar" to be held at the Huangpu Aviation Tire Science Center in Guangzhou on April 20th. It is jointly held with the Huangpu District New Materials Industry Federation and its chair unit (the Huangpu Materials Research Institute of the Guangdong-Hong Kong-Macao Greater Bay Area)

      2025-09-02 admin
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